Information
Fabless Semiconductor Company
Founded in 2017 in Korea to commercialize super speed WPAN solutions for wireless connector/cable applications
World’s first IEEE 802.15.3e fully compliant chipset released in Oct. 2017 using 60 GHz mmWave technology
Supports 5 Gbps data transmission and 9 Gbps video streaming today
Disruptive innovation for wireless TV, wireless digital signage, wireless VR/AR/XR, wireless car connectivity, and so on
Released two generations of Modem/RF integrated SoC chipset solution
50+ patents granted and/or pending